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home > YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max Option:M.Y Middle Layer Reballing kit (X-17PM) Features: Infinite Expansion Ports/Three-screen Simultaneous > YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max Option:M.Y Middle Layer Reballing kit (X-17PM) Features: Infinite Expansion Ports/Three-screen Simultaneous
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YCS M.Y CPU Middle Layer Reballing Platform for iPhone X 17 Pro Max Option:M.Y Middle Layer Reballing kit (X 17PM) Features: Infinite Expansion Ports Three screen Simultaneous Features: Infinite Expansion Ports Three screen Simultaneous Display Wireless Connection High Power Output Fast Heat Dissipation A series: A100 Y A11 A19 Pro CPU reballing kit: 1x Magnetic base It safely and effectively resolders iPhone CPU or mid frame solder joints
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YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max Option:M.Y Middle Layer Reballing kit (X-17PM) Features: Infinite Expansion Ports/Three-screen Simultaneous

Item no : 6759798445
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US$ 45.99
Pay in 4 interest-free payments of $11.50 Learn more
Min. order: 1piece

Shipping Estimate
USA
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Ships within 48 hours · Estimated delivery Nov 2 - Nov 7

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US$ 45.99

1-11

US$ 41.39

12-35

US$ 32.19

36-59

US$ 27.59

60+

US$40

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Shipping Notes
  • Free Standard Shipping on $100+ Orders to the USA.
  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
  1. Standard Shipping : 3-10 business days
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Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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